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BGA Inspection Microscope
(for use with TV/PC) MS-3000

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BGA Inspection Microscope(for use with TV/PC) MS-3000



Product:BGA Inspection Microscope(for use with TV/PC)
MS-3000


Price: 1,344,000Yen (Includes 5% Consumption Tax)
(List Price: 1,280,000Yen)

Announced: February, 2006

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BGA Inspection Microscope(for use with TV/PC) MS-3000



The Feature

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The Feature





The Feature The MS-3000 is a microscope for effectively inspecting the soldered portions of the BGA and CSP which are difficult to reach by the X-ray inspection method. Specifically, it is efficient for inspecting the fillets of soldered balls, melted condition of soldered parts, cracks, and defective soldering. Since inspection is done using the backlight and the two sidelights on the camera, inspection of soldered balls at a depth of 15mm can be done using the 70x L Probe. It can also be used for inspecting the bridges of the soldered balls. The LH Probe with a magnification of from 70x to 140x is suitable for the inspection of small soldered balls on BGAs and CSPs. We recommend that you set the magnification to 140x for inspecting the soldering portions on BGAs and CSPs. The SH Probe with a magnification of 300x is suitable for the inspection of soldered balls with a height of approximately 0.1 mm on BGAs, CSPs, and bridge chips. Also, by mounting the standard-shipped straight prism at the head, the MS-3000 can inspect the surface-mounted parts of QFPs. From an angular position, it can be used to inspect the melted and un-melted status of soldering. The microscope can be connected to the PC with the UB pack (USB2.0 connection). Electric power can be supplied from the PC via the USB cable. A viewer software for image storing, two-point calibrating, and a marker function is also standard-shipped with the microscope.  
Note: The Holder to hold the print board is an option.
The following three types of Camera Probes are available:
Select the Probe that best fits your needs.

L Probe 70x P=1.27 - 1.0

Minimum height of observation=0.3mm
LH Probe 70x - 140x P=0.8 - 0.5

Minimum height of observation=0.15mm
SH Probe 300x P=0.5 (Suited for CSP)

Minimum height of observation=0.05mm

The MS-3000H and MS-3000SH Probes
H Probe has a magnification of 140x and the SH Probe, 300x.

Note: (1) shows the basic system. Users can select between the camera with the L Probe (70x) or the H Probe (140x) at the time of ordering.

The Specification
The Specification
The Specification

USB2.0 interface on 100% compatible DOS/V AT machine
(not compliant with the Expanded USB2.0 spec)

Image output
NTSC
Picture Elements
1/4-inch Color CCD, 410K pixels
Maximum resolution
VGA: 640 x 480
Minimum Operating Environment
Intel Pentium III 850MHz or above
OS Windows2000/XP
Lighting Halogen lamp

L Probe

L Probe

You can easily observe the soldering ball from the near side to deep inside an object by merely turning the focus knob on the Camera Probe. You can also observe it from an angle. As a result, you can confirm the status of the soldering of the soldered ball, fillet formation, soldered ball defects and positioning. You can also confirm if there is a bridge or not by observing the object from the center.

LH Probe

LH Probe

With a magnification of 130x, the LH Probe is ideal for observing the soldering at the first to the third rows and also for observing the CSP packages.

LH Probe

LH Probe

By mounting the standard-shipped QFP prism, you can observe the lead soldered portions and other mounted portions of QFPs from an angle. Since there is ample luminescence, you can also observe the back fillets. The reflection from the soldering is negligible.

SH Probe

SH Probe

The SH Probe has a high magnification of 300x and is ideal for observing the soldered balls in the first row. Also, it is suited for observing CSP packages whose space between the package and the print board is less than 100 microns.
Defective BGA samples

Defective BGA samples

CSP
CSP

Jreed
Jreed

Defective alignment
Defective alignment

Leftover cream solder1
Leftover cream solder1

Leftover cream solder2
Leftover cream solder2

Cream splatter
Cream splatter

Dust adhesion
Dust adhesion

Dust adhesion, leftover cream
Dust adhesion, leftover cream

Leftover flax
Leftover flax

Bridge 1
Bridge 1

Bridge 2
Bridge 2

Bridge 3
Bridge 3

Floating balls
Floating balls

Unsoldered bottom portion 1
Unsoldered bottom portion 1

Unsoldered bottom portion 2
Unsoldered bottom portion 2

Defective upper portion
Defective upper portion

Distortion
Distortion

Distortion, Leftover cream solder 1
Distortion, Leftover cream solder 1

Distortion, Leftover cream solder 2
Distortion, Leftover cream solder 2





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