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Soldering Inspection Video Microscope
(for use with PC/TV) MS-1000

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Soldering Inspection Video Microscope(for use with PC/TV) MS-1000



Product:Soldering Inspection Video Microscope(for use with PC/TV)
MS-1000

MS-1000
Price:
441,000Yen (Includes 5% Consumption Tax)
(List Price: 420,000Yen)
MS-1000LW
Price:
546,000Yen (Includes 5% Consumption Tax)
(List Price: 520,000Yen)
MS-1000EX
Price:
651,000Yen (Includes 5% Consumption Tax)
(List Price: 620,000Yen)

Announced: February, 2006

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Soldering Inspection Video Microscope(for use with PC/TV) MS-1000



The Feature

The Specification

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The Feature

The Feature

The Feature

The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc. It can be used to inspect soldered balls at a maximum magnification of 140x and a maximum height of 0.2mm.
Also, by mounting the standard-shipped straight prism at the head, the MS-1000 can inspect the surface-mounted parts of QFPs. From an angular position, it can be used to inspect the melted and un-melted status of soldering.
※Note: Also available are the MS-L000LW with a magnification of 70x and the magnification adjustable MS-1000EX with a magnification of 70x to130x. The microscope can be connected to the PC with the UB pack (USB2.0 connection). Electric power can be supplied from the PC via the USB cable. A viewer software for image storing, two-point calibrating, and a marker function is also standard-shipped with the microscope.


Notes:
1.Shows a sample configuration of the MS-1000 Microscope with the BL-System-03 Backlight.
2.You can observe an object with the camera locked by fixing the MS-1000 Camera Probe to the Camera Fixture and Stand (HF0001 & 0002 and Stand).


Sample Image

BGA1

BGA1

Shows the condition where the soldered ball is flaked from the print board. It results from the warping of the print board. This image was taken by pushing down the print board to confirm the warped status.

BGA2

BGA2

You can confirm the following conditions by moving the camera probe forward and backward:
・ The soldering state of the soldered ball with the print board
・ The surface state of the soldered ball
・ The soldering state of the soldered ball with the package (bottom shows the print board and top shows the package)

QFP

QFP

You can observe the QFP mounted parts from various angles using the Straight Prism.



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The Specification

The Specification
Model Magnification (Approx.) Focus Distance (Approx.)
MS-1000LW
70x 12mm
MS-1000EX
70x~140x (Variable) 5.0mm at 70x
2.5mm at 140x
MS-1000
140x 2.5mm
PC Interface

USB2.0 interface on 100% compatible DOS/V AT machine
(not compliant with the Expanded USB2.0 spec)

Image output
NTSC
Picture Elements
1/4-inch Color CCD, 410K pixels
Maximum resolution
VGA: 640 x 480
Minimum Operating Environment
Intel Pentium III 850MHz or above
OS Windows2000/XP
Lighting White LED

Configuration


MS-1000 Camera Probe
x 1 pcs
Camera Cable x 1 pcs
AC Adapter
x 1 pcs
RCA Cable
x 1 pcs
Straight Prism
x 1 pcs
USB Pack
USB Interface Cable
USB Cable
Device Driver Software
Viewer Software
Glass Scale

x 1 pack

Note: Specifications and design may change without prior notice.

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